DIP type / Through hole type

This is a type of connector in which a through hole is made to mount a component on a printed circuit board, and the legs (leads) of the component are passed through and soldering (mounted).

It is a type in which a hole is made in the board and plating (VIA) with plating that connects with the trace is applied, and the "lead" of the connector is inserted there and soldered.

As a feature, the mechanical strength of the board mounting can be kept high, but there are also aspects where it is difficult to reduce the size and mount it at high density. In principle, connectors are soldered by hand or flow process, and the disadvantage is that it can not cope with the mainstream reflow process in recent years. However, while taking advantage of this type, there is also a connector with a special specification called "pinyin paste" that enables implementation in the reflow process (also called "through-hole reflow", "reflow dip", etc.). In this type, cream soldering once extruded out of the through-hole is soldered by sucking it up by capillary action during the process of passing through the reflow furnace.