Concept of relay I/F connector and Floating Socket for in-vehicle applications. Floating structure is provided in Socket on the board mounting side, and the connector Floating when Mating to absorb assembly misalignment. Prevents solder cracks. In addition, by inserting a relay I/F connector between the wire harness and Socket on the board mounting side, the pin arrangement of the wire harness is converted within the relay I/F connector and connected to the board mounting connector. By changing only the relay I/F according to the wire harness to be used, common boards and units are realized.
 

0.8mm pitch, Z Floating Floating structure type Stacking connection Board to Board Connector connector for connection in equipment intended for use in harsh vibration environments. Floating 0.5mm X Y direction to 0.5mm Floating in construction. 0.02mm resonance amplitude and 0.5mm effective Mating length in the Z direction. Employs two-point contact for reliable foreign object removal even in tough environments. 125°C rated product for use in high-temperature environments. IRISO Utilizes the industry's proprietary Floating structure technology, Z-Move structure ™. This connector has excellent vibration and shock resistance that prevents contact misalignment due to resonance and shock by Floating moving in the Z direction while the contacts remain fixed. The use of a narrower pitch has enabled a space saving compared to the conventional 10120 series (approx. 50% reduction). We will strongly support your design by proposing a fixing method adapted to your equipment through vibration simulation.
 

Pin header Socket (pitch: 2.54mm, 0.64mm square) with Floating structure (Floating Mating part).
The bottom mating method, which is most suitable for board Mating, is adopted, and by replacing the conventional manual soldering board connection with a connector, the delicate soldering process is eliminated and the connection reliability is improved.