
This is a power module Socket (pitch 2.54mm) with Z-Move structure Floating pitch for internal connections designed for use in severe vibration environments. It uses a bottom Mating method that is ideal for board stacking, and by replacing the conventional hand soldering board connection with a connector, it eliminates the delicate soldering process and improves connection reliability.
- Bottom Mating method (pin insertion from the bottom of the connector) is used, which is suitable for board stacking
- Mass production of 3 to 10 pole products
- 125℃ rated for automotive environments
In addition to Floating structure, the housing is equipped with retaining brackets on both ends to reduce the load on the soldered parts due to external forces.
Item | unit | content |
---|---|---|
category | – | 2.54 Pitch Board to Board Connectors |
Mating part pitch | mm | 2.54 |
Board mounting pitch | mm | 2.54 |
Array | – | 1 column |
Rated voltage | V (AC/DC) | 125 |
Rated current | A | 1 |
Operating temperature limit | ℃ | -40~125 |
Floating amount X | mm | 0.5 |
Floating amount Y | mm | 0.5 |
Floating amount Z | mm |
「イリソコネクタ型番の見方」をご参照ください。
・The specifications of each series (body height, plating, board mounting method, reference drawings, etc.) are posted.
・The drawings shown are for reference only. For details, please refer to the product drawing for each individual product.
body height | plating | Board mounting method | Products |
---|---|---|---|
21.32mm | tin | SMT |
This is Socket Connectors with a mounting height of 21.32 mm.