SMT type（Surface Mount type）

This is a type of connector that soldering (mounts) parts directly to an integrated circuit using surface mount technology.

The leadframe is placed on pads on the board that are cream soldering and soldered in a reflow oven. Many other board-mounted components such as semiconductors also fall under this type. The legs for connection are arranged in a horizontal direction, and the uniformity of the height of the legs, which is called coplanarity due to the characteristics of surface mounting, is a more important quality control item than the DIP type. In addition, overheating in the reflow oven can cause deformation and warping of the plastic parts of the connector, so it is important to select the resin material, design the structure, and optimize the molding conditions.

As a feature, it is suitable for miniaturization/high-density mounting compared to the DIP type. On the other hand, in order to make up for the mounting strength to the board, which is relatively inferior, it often has accessory parts/mechanisms. In addition, the lead for soldering is less likely to cause a state called "stub", so there is also an advantage that it is easier to design for high-speed transmission than the DIP type.