Power unit assembly demonstration
We envision a fully Robot assembly uses Yamaha Motor's SCARA robot "YK510XE" and linear conveyor "LCMR200" to centralize the process from mounting to assembly of power module units for in-vehicle inverters.
The process of removing the dust-prevention "caps," which is a challenge in automating circuit board assembly, can also be handled quickly, making this a demonstration that is close to a mass production process.
The leads of the power semiconductor are Mating in the Z-Move structure Socket 18021S mounted on the gate substrate to accommodate vibration resonance.
In addition, the connectors mounted between the boards are the 10120 series with Z-Move structure and the 10109 series with Floating structure mounted on the same board, allowing them to be Mating even when used in large numbers, which is an advantage of Floating structure.
We have achieved Robot assembly using general-purpose SCARA robots and linear conveyors that absorb mounting misalinment and assembly position deviations.
The process of removing the dust-prevention "caps," which is a challenge in automating circuit board assembly, can also be handled quickly, making this a demonstration that is close to a mass production process.
The leads of the power semiconductor are Mating in the Z-Move structure Socket 18021S mounted on the gate substrate to accommodate vibration resonance.
In addition, the connectors mounted between the boards are the 10120 series with Z-Move structure and the 10109 series with Floating structure mounted on the same board, allowing them to be Mating even when used in large numbers, which is an advantage of Floating structure.
We have achieved Robot assembly using general-purpose SCARA robots and linear conveyors that absorb mounting misalinment and assembly position deviations.
Demonstration video
Name: 38th Internepcon Japan
Date: Wednesday, January 24th – Friday, January 26th, 2024
Host country: Japan
Name: 2024 Automotive Technology Exposition Yokohama/Nagoya
Dates: Yokohama: May 22nd (Wed) - 24th (Fri), 2024 Nagoya: July 17th (Wed) - 19th (Fri), 2024
Host country: Japan
Exhibited products
10120 series
This 2.0mm pitch, Z-Move structure Floating Floating structure Stacking connection (ST/ST) Board to Board Connector connector is designed for use in severe vibration environments. Its Floating structure design Floating Floating X Y direction. The Z-axis has a resonance amplitude of 0.02mm and an effective Mating of 0.8mm. It features a two-point contact that reliably removes foreign matter even in tough environments. It is rated for temperatures up to 125°C. It utilizes IRISO 's proprietary Floating structure technology, "Z-Move structure" (registered trademark). This connector offers excellent vibration and shock resistance, with contacts that Floating in the Z direction while remaining fixed, preventing contact misalignment due to vibration resonance or impact. IRISO proprietary analysis system will simulate the optimal mounting method for your equipment.
10109 series
This 0.635mm pitch, Floating structure type Stacking connection (ST/ST) Board to Board Connector connector enables high-speed digital signal transmission. Its Floating (Floating structure) structure allows 0.5mm Floating in X Y direction. The effective Mating length in the Z direction is 0.5mm. It supports high-speed transmission of 3.0Gbps (a representative reference value defined by the company). Impedance matching: 100Ω differential. It features a two-point contact that can accommodate various Mating heights and reliably removes foreign matter even in tough environments.
18021S series
A pin header Socket (pitch: 2.54mm, 0.64mm square) with Floating structure (Floating Mating part). It uses a bottom Mating method that is ideal for board stacking, and by replacing the conventional hand soldering board connection with the connector, it eliminates the delicate soldering process and improves connection reliability.