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High-speed transmission Floating structure Board to Board Connectors "10143 family" 10143 family

High-speed transmission Floating structure Board to Board Connectors "10143 Family"

10143 Family Lineup

This product group supports high-speed transmission while retaining the superior features of previous models, such as Floating Connector and Auto I-Lock structure ™ structure. Even with terminals with complex structures, a stable impedance profile enables high-level high-speed transmission.

Main features

Feature 1: High-speed data transfer of up to 25Gbps enables Floating beyond the pitch width

The recent trend toward more sophisticated equipment and increased data volumes is spurring demand for high-speed transmission in connecting components. Furthermore, the increase in high-frequency components in signals has led to situations where attention must be paid to even minute details that previously did not pose a problem. High-speed transmission compatible products are optimally designed by organically combining numerous on-site evaluations and simulations.

The 10143 series supports various transmission standards including PCIe Gen 4, achieving high-speed transmission of up to 25Gbps*.

Another major feature is that it combines IRISO' Floating structure technology with high-speed transmission, making it highly reliable and easy to use.

*When measured according to the "OIF CEI-28G-SR" standard

high-speed

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Feature 2: Power supply terminals contribute to space saving

By locating the power terminals on both ends of the product, there is no need to allocate terminals for power supply, which contributes to miniaturizing the connector.

This power terminal also serves as a fixing bracket, making it possible to miniaturize the entire connector, thereby reducing the area that the connector occupies on the board.

PowerPins

Feature 3: High heat resistance specification compatible with in-vehicle equipment

Due to the increase in heat generated around the engine in automotive equipment and due to the increasing functionality of devices, connector products are also required to have high heat resistance.

Our highly heat-resistant products, realized through the full use of materials and design technology, can be used safely even in harsh high-temperature environments up to 125°C.

High heat resistance

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Solutions

Individual specifications

  10143B 10143S 10144B 10143S
Product images
Connector Orientation Vertical Right Angle Vertical
Pin Counts (Pin) 20~160 20~160
Mating Height (mm) 10.0~30.0
Board mounting method SMT
Pitch 0.5mm
Transmission speed 25 Gbps
Rated voltage 50 V(AC,DC)
Rated current (signal) 0.5A
Rated current (power supply) 3.0 A
Operating temperature limit -40~+125℃
Array Dual Row
Connection method (contact) 1 point
Floating structure X: ±0.8 Y: ±0.8
 

Other detailed specifications, please check the product search.

The contents and specifications are subject to change.
We can introduce you to the most suitable product depending on your application, so please contact us if you are considering it.

Approximate dimensions

10143B

Pin Counts Product Number A B C.
20 IMSA-10143B-20A/B-GFN4 7.40 15.5 6.6
40 IMSA-10143B-40A/B-GFN4 7.40 20.5 6.6
60 IMSA-10143B-60A/B-GFN4 7.40 25.5 6.6
80 IMSA-10143B-80A/B-GFN4 7.40 30.5 6.6
100 IMSA-10143B-100A/B-GFN4 7.40 35.5 6.6
120 IMSA-10143B-120A/B-GFN4 7.40 40.5 6.6
140 IMSA-10143B-140A/B-GFN4 7.40 45.5 6.6
160 IMSA-10143B-160A/B-GFN4 7.40 50.5 6.6

10149S

Pin Counts Product Number A B C.
20 IMSA-10143S-20C/D-GFN4 9.1 17.2 7.3
40 IMSA-10143S-40C/D-GFN4 9.1 22.2 7.3
60 IMSA-10143S-60C/D-GFN4 9.1 27.2 7.3
80 IMSA-10143S-80C/D-GFN4 9.1 32.2 7.3
100 IMSA-10143S-100C/D-GFN4 9.1 37.2 7.3
120 IMSA-10143S-120C/D-GFN4 9.1 42.2 7.3
140 IMSA-10143S-140C/D-GFN4 9.1 47.2 7.3
160 IMSA-10143S-160C/D-GFN4 9.1 52.2 7.3

Wide variety

A wide variety of variations are available, with board-to-board heights of 10 to 30 mm and Pin Counts ranging from 20 to 160.

Development background

As global environmental issues become more serious, the global trend toward decarbonization is driving a shift to electric vehicles (EVs). IRISO Electronics is strengthening its development of connectors suitable for EV ECU devices and is working to realize a carbon-neutral society.

We have developed a Board to Board Connector connector suitable for in-vehicle environments that contributes to the miniaturization and weight reduction of devices.

  • – 0.5mm pitch
  • – Power terminal included

Functions and characteristics

Transmission characteristics – S-parameters

It shows good data for various S-parameter thresholds, and the characteristic impedance is adjusted to comply with various transmission standards.

Insertion Loss (Sdd21)

Return Loss (Sdd11)

Differential Impedance
[Rise time: 75ps 10% to 90%]

Differential Near End Crosstalk
(PSNEXT)

Transmission characteristics – 25Gbps high-speed transmission

It has also been adopted and used for high-speed transmission applications of 25Gbps* for board-to-board connections within 5G wireless base stations.

*When measured according to the "OIF CEI-28G-SR" standard

※Resource: OIF Forum CEI-28G-VSR

PIN Assignment

Reference for OIF CEI-28G-SR (25Gbps+)

Insertion Loss
Return LoSS

Mechanical Reliability

Assuming misalignment within the allowable Floating structure range, we intentionally apply stress at maximum Floating structure to verify the occurrence of soldering cracks. We also observe cross sections and resistance fluctuations during the test to confirm the condition of soldering parts.

  • Thermal shock: 0 to 100°C (Duration 15 minutes)
  • Number of cycles: 3,000 cycles
  • Crack Rate: See below

Crack Rate

Observation of soldering cross section

Check resistance fluctuations

Thermal shock test (0 to 100 cycles) Floating
Thermal shock test (2900-3000 cycles) Floating

 

*Content may be changed without notice due to improvements, etc.
We can introduce you to the most suitable product depending on your application, so please contact us if you are considering it.